Date: 22 July 2005
The new E400S-75 saw was developed exclusively for Corning by HCT Shaping Systems SA and will be used in cutting Corning HPFS® 7980 fused silica for the production of LCD image mask blanks in the display market.
The HCT E400S-75 wire saw has the capability to cut ultra-hard materials such as silicium, sapphire or quartz up to a size of two meters in diameter. In addition to enabling low kerf-loss (the amount of material lost during the cutting process), this tool also enables precision flatness and uniform thickness throughout the cutting process.
Danny Henderson, division vice president and business director, Corning Specialty Materials said, HCT Shaping Systems SA has once again demonstrated its technology and development leadership in the multi-wire saw industry. This leading-edge technology will significantly improve Cornings manufacturing capabilities for the production of LCD image mask blanks.
Stefan Schneeberger, chief executive officer, HCT Shaping Systems SA, said, A precision multi-wire saw of this size is the first of its kind. Both the record size and the collective effort to develop this machine have been extraordinary. In August 2004, the first lines were drawn on our CAD systems, and a mere eight months later, the 50-ton, 8-meter-high wire saw made its first cuts.