Date: 21 March 2016
Fonon Corporation (OTC: FNON) today announced improvements to Zero Width Laser Cutting Technology, a non-contact method for cutting glass and other non-metallic, brittle materials on the molecular level.
The advancements have direct applications in the semiconductor, flat panel, solar, and medical glass industries.Traditional approaches to cutting glass, including mechanical scribe and break, grinding, and sawing with physical cutting tools have been mainstays of glass processing for centuries.
Conventional saw-and-blade methods such as these unavoidably result in micro-cracks, weakened surfaces, and glass edges that are highly prone to cracking. These issues are compounded by the recent explosion of new types of chemically-strengthened glass, such as Gorilla Glass, which is found in nearly two billion smart phones and tablet computers.
As glass strength increases, traditional cutting methods become more expensive and less effective, introducing cracks, splinters, and more wasted material.Zero Width Laser Cutting Technology uses a non-contact laser to create internal tensile forces greater then inter-molecular connections in glass or other brittle materials, effectively separating the material cleanly, without the debris, loss, and quality problems associated with traditional glass processing.
Waste material is largely eliminated, and the approach works with all types of glass.Recent refinements by Fonon allow products which incorporate Zero Width Laser Cutting Technology to achieve much deeper penetration of a precisely controlled micro-crack.
The process creates high-speed scribe lines (up to 1 meter per second, depending on the material type and thickness) in a prearranged manner, with no molecules leaving the surface, dramatically improving the substrate separation process.
Edge impact strength increases when glass is cut by this process; the result is up to five times stronger than material cut by mechanical scribe and break methods.
“Both manufacturers and consumers benefit immediately,” said Ben English, Chief Marketing Officer of Fonon Corporation. “Zero Width Laser Cutting Technology provides higher material strength for all types of glass, and less possibility of damage either at the factory or in the customer’s hand.”Cutting systems incorporating Fonon’s latest Zero Width Cutting Laser Technology are available immediately, in standalone systems, for the flat panel display, medical device, and precision optics industries.
For more information, see the Fonon blog entry, “What is Zero Width Laser Cutting Technology?” by following this link or contact Fonon for more details.About Fonon CorporationFonon designs laser-based material processing technologies for advanced industrial manufacturing and manufactures state of the art equipment utilizing those technologies.
The company products empower manufacturers in the areas of application-specific 3D metal printing (additive manufacturing), and 2D and 3D laser cutting, marking and engraving applications (subtractive manufacturing). Our products and technologies are used today in every sector of any manufacturing industry from food and beverage to medical, aerospace and semiconductor.
For more information, visit www.fonon.us.
Notice Regarding Forward-Looking Statements
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 involving risks and uncertainties. Results, events and performances could vary from those contemplated. These statements involve risks and uncertainties which may cause results, expressed or implied, to differ from predicted outcomes. Risks and uncertainties include but are not limited to product demand, market competition and the company’s ability to meet current and future plans. Investors should study and understand all risks before making an investment decision. Readers are recommended not to place undue reliance on forward-looking statements or information. Fonon is not obligated to publicly release revisions to any forward-looking statement, to reflect events or circumstances afterward, or to disclose unanticipated occurrences except as required under applicable law.