Ultra-Fast Curing, Thermally Stable Epoxy Meets NASA Low Outgassing Specifications

HACKENSACK, NJ - September 30, 2010 - Master Bond EP65HT-1 combines high temperature resistance and fast room temperature curing in a NASA low outgassing approved epoxy.

It also offers superior electrical insulation capabilities and strong chemical resistance.

With an extremely high glass transition temperature exceeding 125ºC, EP65HT-1 features fast cure times, even when mixed in small masses. For example, a 10-20 gram mass will cure in 3-5 minutes at room temperature. It is serviceable over the wide temperature range of -60ºF to +400ºF, has a tensile shear strength approaching 3,000 psi, and a Shore D hardness greater than 75.

EP65HT-1 bonds well to a wide range of substrates including metals, glass, ceramics, rubbers, and many plastics, and is widely used in the electrical, electronic, computer, medical, optical, transportation, aerospace, and OEM industries. The adhesive is dark brown in color and is available in a convenient dispensing gun that mixes the parts with a 10 to 1 ratio. It is also available for use in half pint, pint, quart, gallon, and 5 gallon container kits.

Master Bond Ultra-Fast Curing Adhesives

Master Bond EP65HT-1 is a high temperature resistant, fast curing, room temperature epoxy that meets NASA low outgassing standards. Read more about Master Bond's fast curing epoxies at http://www.masterbond.com/lp/tabs/tp_pp_fastcuring.html or contact Technical Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.



James Brenner, Marketing Manager

Email: jbrenner@masterbond.com

Tel: 201-343-8983

Fax: 201-343-2132


154 Hobart Street

Hackensack, NJ 07601-3922

Web: www.masterbond.com

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600450 Ultra-Fast Curing, Thermally Stable Epoxy Meets NASA Low Outgassing Specifications glassonweb.com
Date: 4 October 2010
Source: Master Bond

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