With a thermal conductivity over 22 BTU•in/ft2•hr•ºF and serviceability from -60 to 400°F, Master Bond EP21ANHT delivers outstanding performance in the most demanding microelectronic applications. The cured adhesive is also a superior electrical insulator, further expanding its usefulness.
This two component adhesive, sealant, and coating has a convenient 1 to 1 mix ratio by weight or volume and offers room temperature and faster elevated temperature cures. EP21ANHT has a low coefficient of thermal expansion of 18-20 in/in x 10-6/ºC, a dielectric strength of >400 volts/mil, and a tensile shear strength greater than 1,000 psi. It resists a wide range of chemicals and adheres well to a variety of substrates.
EP21ANHT is available in pint, quart, gallon and 5 gallon kits.
Master Bond Thermally Conductive Epoxy Systems
Master Bond EP21ANHT thermally conductive epoxy system delivers outstanding heat transfer and high temperature resistance. Read more about Master Bond’s thermally conductive epoxies at http://www.masterbond.com/lp/tabs/tp_pp_thermcond.html or contact Technical Support by phone at +1-201-343-8983, by fax at +1-201-343-2132 or by e-mail at firstname.lastname@example.org.
James Brenner, Marketing Manager
MASTER BOND INC.
154 Hobart Street
Hackensack, NJ 07601-3922