It is widely used for demanding applications in the electronic, electrical, computer, semiconductor, aerospace and optical industries.
The adhesive cures at room temperature in 24-48 hours and in just 1-2 hrs at 200ºF, producing tough high strength bonds. It features a tensile shear strength of more than 1,800 psi, a T-peel of greater than 5 pli, and outstanding adhesion to similar and dissimilar substrates. The volume resistivity of the system is less than 10-3 ohm-cm. Serviceable over the exceptionally wide range of 4K to 275ºF, EP21TDCS-LO is suitable for cryogenic applications. It withstands thermal cycling and is resistant to chemicals, including water, oil and most organic solvents.
The epoxy offers a simple 1 to 1 mixing ratio by weight or volume. With its low drip formula, EP21TDCS-LO can be conveniently applied with a syringe, knife, spatula or trowel to vertical surfaces without sagging and only contact pressure is required for curing. Syringes have a 3 month shelf life and glass jars have a 6 month shelf life, if stored at room temperature. EP21TDCS-LO is available in premixed and frozen syringes, as well as in metal containers.
Master Bond Electrically Conductive Adhesives
Master Bond’s Polymer System EP21TDCS-LO was developed for high performance bonding and sealing where superior electrical conductivity and NASA low outgassing certification is required. Read more about Master Bond’s electrically conductive adhesives at http://www.masterbond.com/lp/tabs/tp_pp_eleccond.html or contact Technical Support by phone at +1-201-343-8983, by fax at +1-201-343-2132 or by e-mail at email@example.com.
James Brenner, Marketing Manager
MASTER BOND INC.
154 Hobart Street
Hackensack, NJ 07601-3922