Triton Microtechnologies receives additional funding to ramp up manufacturing of glass interposers for next-generation semiconductor packaging

Company Invests $3.2 Million in U.S. Manufacturing Facility to Address Gap in Semiconductor Industry Supply Chain    Start-up Triton Microtechnologies, a designer and manufacturer of ultra-thin glass interposers that enable advanced semiconductor-packaging solutions, has met six-month production milestones that have triggered an additional $3.2 million in funding from parent companies Asahi Glass Co., Ltd. (AGC) of Tokyo and nMode Solutions Inc. in Oro Valley, Arizona.

Triton will invest the capital to further develop and equip its established manufacturing facility in Carlsbad, California, where the company is producing its through-glass-via (TGV) interposers for high-density ICs.  

“We are using this new funding to address a critical gap in the supply chain for semiconductor packaging,” said Tim Mobley, CEO of Triton. “To this point, glass interposers have not been readily available, but with silicon interposers now nearing their performance limits, Triton is leveraging its TGV technology to provide the global semiconductor industry with smaller, more efficient and more cost-effective packaging solutions for next-generation ICs.”

Founded in December 2012, Triton combines nMode’s interposer technology with AGC’s glass technology and via-hole drilling techniques to produce 2.5-dimensional (2.5D) and three-dimensional (3D) TGV interposers. These products, capable of forming thousands of electrical connections between a silicon chip and a printed circuit board, are needed to create advanced, high-density semiconductor devices in the smallest form factors.

Triton’s manufacturing facility in Carlsbad, California, employs a highly efficient, continuous process capable of producing ultra-thin TGV interposers in high volumes at low cost. High-aspect-ratio via holes are drilled through glass substrates, then filled with a thermally stable copper paste to form high-quality interconnects within the glass wafers. Triton makes interposers with via-hole diameters from 70 microns to 150 microns and thicknesses of 0.7 mm and below. The company also designs and produces customized solutions to meet customers’ specific applications.

About Triton Microtechnologies

Triton Microtechnologies is a leading designer and manufacturer of high-performance 2.5D and 3D through-glass-via interposers, which allow semiconductor manufacturers to fit more components into smaller package areas to produce advanced, high-density integrated circuits. The company’s proprietary technology offers faster cycle times, known-good-die (KGD) testing at higher packaging integration levels and the lowest cost per unit in the marketplace. For more information, visit

600450 Triton Microtechnologies receives additional funding to ramp up manufacturing of glass interposers for next-generation semiconductor packaging
Date: 30 October 2013

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