The companies have also agreed to work together to better understand the dynamics of the markets for high-frequency electronic components and modules.
DuPont Electronic Technologies is a recognized world leader in rigid, flexible, ceramic and organic materials and processes for electronic circuits. Merrimac is an industry leader with expertise in design, simulation, prototyping and manufacture of multilayer high-frequency modules for use in space, defense and commercial applications.
"Anticipating and meeting the needs of customers in this fast-paced environment is critical. Better understanding the relationship between material properties and high-frequency design will allow us to bring materials to market more quickly," said Dave Miller, vice president and general manager of DuPont Electronic Technologies. "This relationship with Merrimac will help accelerate our understanding of the requirements for electronic materials and move us from circuit materials into materials for integrated circuit packaging and modules."
"By exploring the application of Merrimac's multilayer design expertise with the variety of electronic materials from DuPont, Merrimac will be able to broaden its offerings to new markets and applications," said Mason Carter, chairman and CEO of Merrimac. "This relationship will further identify Merrimac as the recognized source of 3-D integrated modules by providing total integrated packaging solutions. As the 'Module Evolution' spreads across industry segments increasing the outsourcing of multifunction modules, Merrimac is positioning itself to meet the needs of a broad range of signal processing requirements with a breadth of packaging solutions."