The collaboration between the three companies has resulted in an inkjet deposition system which is ideal for the development of new production processes for products such as flat panel displays, RFID tags, PCBs, fuel cells and electronic components.
The solution combines Xaars innovative OmniDotTM piezoelectric inkjet technology with iTis XY Materials Deposition System (XYMDS), a precision fabrication tool for digitally printed electronics, and Cima NanoTechs proprietary nanomaterial ink technologies.
The new system supports up to 4 of Xaars OmniDot 380/40 printheads and uses a dedicated inkjet drive engine (IDE), the Delta XO/760. This includes the drive electronics, ink supply system and user interface necessary to control the printheads. Based on Xaars piezoelectric drop-on-demand technology, the printheads accurately and reliably deliver 40pl drops at up to 8kHz. The heads feature a lightweight alloy cover and nozzle guard to provide the durability essential for demanding production environments.
Xaars Advanced Application Technology group has ensured that the printheads are optimised to jet Cima NanoTechs IJ-1000 Conductive Silver Ink, which is designed for piezoelectric printheads. Cimas IJ-1000 Conductive Silver Ink delivers adhesion to a variety of substrates including glass, polyimide, and PET film, and is available in production quantities.
The XYMDS offers simplified development of production processes for printed electronics. Its proven precision hardware and motion control software offers the ability to accelerate process development and reduce time to market for inkjet based production systems.
Digital printing via piezoelectric inkjet offers important cost and time saving advantages over traditional electronics manufacturing methods. As an additive manufacturing method, inkjet printing offers more efficient materials utilisation and a reduction in process steps. Inkjet delivers increased flexibility by enabling the production of 1-off prototypes and quick turn and volume products. It holds the promise of increased compatibility with a much wider range of fluids and substrates for additional flexibility and cost savings in the future