From cover glasses for large format professional displays in public places to protective glasses for smartphones, tablets and ultrabooks and even control panels and displays in automobiles, the company offers many different solutions.The second main focus will be on wafers made of ultra-thin glass for applications in semiconductor technology, but also for applications in the areas of industry, medical technology and high frequency technology. SCHOTT will be exhibiting its products and innovations at electronica in Munich (Hall A3, Booth 339) from November 11 – 14.
Extremely high impact resistance and enormous resistance to bending are important requirements that today’s cover glass for use in smartphones, tablet PCs and other electronic devices with integrated touch control must meet. Xensation® Cover glass from SCHOTT meets all of these requirements. Photo: SCHOTT.
SCHOTT offers a unique solution for large format touch applications in public areas. The technical glass CONTURAN® even features a special DARO coating (DARO = durable, anti-reflective, oleophobic). In this case, resistance to reflections has been combined with a protective film that resists soiling on cover glasses. The oleophobic, anti-reflective coating clearly resists fingerprints and water and is therefore ideal for use in technical or public displays, interactive kiosk systems in public places, casino game consoles, and for equipping devices that are used in marine and medical technology. More information can be found here:
Extremely high impact bending strength are important requirements that today’s cover glass must meet for use in smartphones, tablet PCs and other electronic devices with integrated touch controls. Xensation® Cover glass from SCHOTT meets its customers’ expectations in all respects. Well-known international manufacturers of electronic devices have been successfully relying on the unique functionality of Xensation® Cover glass in their devices for quite some time.
SCHOTT is the only company in the world that offers a family of materials made of ultra-thin glass wafers that have different product properties: AF 32® eco, D 263® T eco and MEMpax®. Photo: SCHOTT.
The field of application for this glass extends well beyond mobile devices, however. Thanks to a thickness spectrum of 0.5 mm to 3 mm, it is also ideally suited for use in vehicle displays and interior aircraft glazing. SCHOTT and DELO Industrie Klebstoffe cooperated on developing a break-resistant cover glass laminate on the basis of Xensation® Cover glass for vehicle displays and thus contribute toward safer traffic conditions. In this case, a high-tech adhesive creates a bond between the display and the special purpose glass. In a series of tests, the two companies have demonstrated that their new displays meet all of the automobile industry’s safety requirements and protect passengers from cut injuries. SCHOTT also offers other types of glasses for use in automotive applications and constantly develops new solutions that feature new product properties.
HermeS® wafers from SCHOTT with hermetically sealed solid “Through Glass Vias” (TGV): Since HermeS® glass can be placed directly under the silicon MEMS, it makes miniaturized, fully hermetic 3D Wafer Level Chip Size Packaging (WLCSP) possible. Photo: SCHOTT.
For example, SCHOTT offers a family of materials made of ultra-thin glass wafers for use in semiconductor technology that come with different product properties and in customer-specific designs. These are the glass wafer types made of the special glasses AF 32® eco, D 263® T eco and MEMpax® that are manufactured using a special down-draw process that guarantees a fire-polished surface with roughness of under one nanometer. This wide variety of materials offers the semiconductor industry an important advantage of material choice for various uses.
SCHOTT will also be presenting its HermeS® wafers with hermetically sealed solid “Through Glass Vias” (TGV). HermeS® glass substrates enable fully gastight and therefore long-term robust enclosures for MEMS devices. The fine pitched vias allow the reliable conduction of electrical signals and power into and out of the MEMS device. Since HermeS® glass can be placed directly under the silicon MEMS, it makes miniaturized, fully hermetic 3D Wafer Level Chip Size Packaging (WLCSP) possible. Thanks to the extremely high reliability, HermeS® wafer provides advantages in particular for MEMS devices used in industrial, medical and radio-frequency applications. SCHOTT offers HermeS® TGV substrates made from three special glass types: BOROFLOAT® 33 floated borosilicate glass, AF 32® eco alkali-free flat glass and D263®T eco borosilicate glass.
AF 32® eco, BOROFLOAT®, CONTURAN®, D 263® T eco, MEMpax®, and Xensation® are registered trademarks of SCHOTT AG.
Download link to all of the following photographs: https://www.schott-pictures.net/presskit/265557.electronica2014
SCHOTT is an international technology group with 130 years of experience in the areas of specialty glass and materials and advanced technologies. SCHOTT ranks number one in the world with many of its products. Its core markets are the household appliance, pharmaceutical, electronics, optics and transportation industries. The company is strongly committed to contributing to its customers’ success and making SCHOTT an important part of people’s lives with high-quality products and intelligent solutions. SCHOTT is committed to managing its business in a sustainable manner and supporting its employees, society and the environment. The SCHOTT Group maintains close proximity to its customers with manufacturing and sales units in 35 countries. Its workforce of 15,400 employees generated worldwide sales of US$ 2.5 billion for the 2012/2013 fiscal year.