KGS DIAMOND GROUPs R&D spin-off improves production polishing cycles

Date: 6 November 2004

Source: KGS DIAMOND GROUP

Date: 6 November 2004

Hall 15 / Stand E57KGS DIAMOND GROUP is launching a new resin-bond range of diamond products for polishing glass.

Designated as the Swiflex® R55 range and available in discs and belts in a wide range of grit sizes, these products can withstand far more arduous operating parameters than any previous polishing resins.KGS is endeavouring to increase production process speeds in many glass polishing applications.

Ongoing R&D is to develop a stronger heat resistant resin product for the Engineering Markets. This is to compete against conventional SiC and aluminium oxide abrasives for dry or other difficult applications.

Used wet on glass, Swiflex® R55 tests have shown exceptional life on applications previously unsuitable for existing resin-bond diamond abrasives.

KGS has already established the patented TELUM pattern as the market leader for edging glass in automatic lines for tempering. These Swiflex® R55 resins are the perfect complement to existing electroplated nickel products for many applications.

600450

KGS DIAMOND GROUP

2004-11-06T12:00:00

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