KGS DIAMOND GROUP’s R&D spin-off improves production polishing cycles

Date: 6 November 2004
Source: KGS DIAMOND GROUP
Hall 15 / Stand E57KGS DIAMOND GROUP is launching a new resin-bond range of diamond products for polishing glass.

Designated as the Swiflex® R55 range and available in discs and belts in a wide range of grit sizes, these products can withstand far more arduous operating parameters than any previous polishing resins.KGS is endeavouring to increase production process speeds in many glass polishing applications.

Ongoing R&D is to develop a stronger heat resistant resin product for the Engineering Markets. This is to compete against conventional SiC and aluminium oxide abrasives for dry or other difficult applications.

Used wet on glass, Swiflex® R55 tests have shown exceptional life on applications previously unsuitable for existing resin-bond diamond abrasives.

KGS has already established the patented TELUM pattern as the market leader for edging glass in automatic lines for tempering. These Swiflex® R55 resins are the perfect complement to existing electroplated nickel products for many applications.

600450 KGS DIAMOND GROUP’s R&D spin-off improves production polishing cycles glassonweb.com

See more news about:

Others also read

The perfect match: a small sized glass processing company opts for a cutting table from the base series, engineered by LiSEC.
Since the glasstec 2018 the VirtualDigitizing version 18.1 is available.
Take a look at Tecglass' technology at work.
The ‘World of Innovative Glass Lamination Solutions’ – an international design competition for projects using laminated glass or laminated safety glass – took place between June 11 and September 7.
We want to share these happy moments with you!
Solid machine construction and first-class printing quality have always distinguished the screen and digital printing machines of THIEME GmbH & Co. KG.

Add new comment