3D-Micromac AG acquires TLS-Dicing from Jenoptik

Jenoptik and 3D-Micromac AG announce the technology transfer of thermal laser separation (TLS-Dicing) as part of a so-called asset deal.

As of January 1, 2014, know-how, patents and results of the development from Jenoptik’s Laser & Materials Processing Division are transferred to 3D-Micromac AG in Chemnitz.  

Laser technology for separating microchips complements the Chemnitz company’s product portfolio.   

Immediate commercialisation of the technology by 3D-Micromac will be possible with the transfer. With the acquisition, the company reinforces its know-how as a system provider for laser systems in the semiconductor industry and advances the expansion of its product portfolio in this area. Jenoptik’s Laser & Materials Processing Division will continue in the future to focus on the 3D processing of plastics and metals, e.g. in the automobile industry.

‘With TLS-Dicing we obtain a technology that will perfectly complement our product portfolio in the semiconductor industry and enable us to expand our market position. In addition to component processing at wafer level we can now also offer innovative solutions for separating of microchips, according to Tino Petsch, CEO of 3D-Micromac AG. ‘In the coming months, we will continue to further develop the process in co-operation with the Fraunhofer IISB and implement it in industry-ready machine technology’, Petsch continued.

‘Jenoptik’s Laser & Materials Processing Division has increasingly focused on its core markets and sharpened its portfolio in recent months’, said Dietmar Wagner, general manager of JENOPTIK Automatisierungstechnik GmbH, following the contract’s signing. ‘We are pleased that with 3D- Micromac AG we have found a buyer for TLS-Dicing, which wants to successfully commercialize the technology in the shortest possible time’, said Wagner further.

Background information on thermal laser beam separation (TLS-Dicing) TLS-Dicing (thermal laser beam separation) is used in the semiconductor industry’s back-end to separate semiconductor wafer in components. A laser heats up the material locally and a cooling medium cools it down immediately afterwards. The thermally induced mechanical stress leads to a complete cleaving of the wafer.

The method is suitable for most brittle materials in the semiconductor industry, including Si, SiC, Ge and GaAs wafers. Compared to traditional separation technologies, TLS-Dicing impresses with clean, micro-crack-free edges and greater resulting bending strength. Process speeds of 200 mm/s to 300 mm/s are possible and generally lead to a multiplication of throughput. The high throughput and wear- free processing offer great potential for reducing production costs / cost of ownership.

About 3D-Micromac AG

3D-Micromac AG has become one of the leading suppliers of highly efficient laser micromachining systems as well innovative coating and printing technologies on the international market since its foundation in 2002.

Stand-alone systems as well as entire production lines can be offered and are used, for example, in medical technology, the processing of semiconductors, in photovoltaics or the production of flexible electronic components. Besides, 3D-Micromac is your competent partner for the development of new technologies and processes or customized systems.

About Lasers & Material Processing division of Jenoptik

With its Lasers & Material Processing division, Jenoptik is one of the leading providers of laser technology and provides products and solutions along the entire value-added chain of laser material processing – from components up to complete laser systems. In the Lasers business unit, the company has specialized in high-quality semiconductor lasers, reliable diode lasers as modules or systems as well as innovative solid-state lasers such as disk and fiber lasers. This product portfolio makes Jenoptik the ideal partner for the entire pulse width range, from cw to fs. In the field of high- power diode lasers, the company is acknowledged as a worldwide quality leader. In the Laser Processing Systems business unit, Jenoptik develops and manufactures laser machines which are integrated into its customers’ production lines as a part of their process optimization and automation. They serve for the processing of plastics, metals and glass in connection with the processing of thin films. Jenoptik laser systems ensure processing at maximum efficiency, precision and safety. In addition, customers can try out various laser sources and machines at the Application Centers, thus finding the optimal solution for their application. The product portfolio is rounded off with energy- efficient and environmentally friendly exhaust cleaning systems for residue-free removal of pollutants during laser processing and other industrial processes.

Press contact 3D-Micromac AG Mandy Gebhardt Marketing and Public Relations

Phone: +49 (0)371 400 43-26 E-Mail: gebhardt@3d-micromac.com http://3d-micromac.com// Jenoptik l Laser & Materialbearbeitung Denise Thim Communication and Marketing

Phone: +49 (0)3641 65 4366 E-Mail: denise.thim@jenoptik.com www.jenoptik.com/lm// http://tls-dicing.com/3d-micromac-acquires-tls-dicing/

600450 3D-Micromac AG acquires TLS-Dicing from Jenoptik glassonweb.com
Date: 27 January 2014
Source: 3D-Micromac AG

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