The program is a non-exclusive open alliance to support thin silicon wafer handling in the semiconductor industry. Under the terms of the agreement, the companies will join forces to promote integrated solutions for semiconductor wafer thinning and stress removal, along with advanced techniques for thin wafer handling and transport. The alliance also calls for all companies to engage in joint marketing initiatives.
Current global partners of the program include: ESEC, PROTEC group AG, Integrated Dynamics Engineering, Silicon Quest International, Dymatix Automation Systems, SEZ Group, Teikoku Taping Systems Co. Ltd. and Carinthian Tech Research AG. Tru-Si, a high technology wafer thinning and handling equipment company, has been involved in the Entegris program since September 2002.
The purpose of our Ultra-Thin Wafer Partner Program is to demonstrate compatibility between high performance wafer thinning equipment, processes and thin wafer handling, and transport systems, said Patrick McKinney, president of the Entegris semiconductor market segment. Partnering with these leaders in the industry enables us to maintain and expand our leadership role by creating the next generation of solutions for thin and ultra-thin wafer handling and transport.