This announcement is in line with previous announcements that the company would be prepared to ship substrates to customers from this facility during 2005.
The company expects to begin shipping TFT-grade glass to its customers this month.
Corning broke ground on the Taichung facility last July and expects to hold its official grand opening ceremony in January 2006. Corning's board of directors recently approved an additional capital expenditure plan of US$425 million for the third-phase expansion of the Taichung facility, bringing the total capital expenditure for the new plant to about US$1.5 billion.
The majority of the phase three expenditure will be incurred during 2006 and 2007. The Taichung facility will ultimately manufacture 5.5-generation (5.5G), 6G, 7.5G and larger glass substrates for panels to be used in monitors and TVs.