To package temperature-sensitive glass/glass and glass/ceramics components, especially those with large substrate surfaces to be sealed, a laser-based joining process that uses glass solder is becoming more and more significant.
The Fraunhofer Institute for Laser Technology (ILT) is developing the appropriate irradiation strategies and processing heads to achieve this.
Laser-soldered glass/silicon sensor package. (Image: Fraunhofer ILT, Aachen)
The advantage of the laser-based joining process is that the laser beam is able to apply energy to a limited space in order to melt the glass solder precisely, thus generating a bond with long-term, stable hermeticity.
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