The Fraunhofer Institute for Laser Technology (ILT) is developing the appropriate irradiation strategies and processing heads to achieve this.
Laser-soldered glass/silicon sensor package. (Image: Fraunhofer ILT, Aachen)
The advantage of the laser-based joining process is that the laser beam is able to apply energy to a limited space in order to melt the glass solder precisely, thus generating a bond with long-term, stable hermeticity.
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