Toughened Two Part Epoxy Adhesive/Sealant Meets NASA Low Outgassing Specifications and is Cryogenically Serviceable

Date: 16 November 2010
Source: Master Bond Inc.
HACKENSACK, NJ - November 11, 2010 - Master Bond's EP21TDCHT-LO two part epoxy adhesive/sealant is specially formulated for demanding applications where factors like temperature cycling, high vibration, and mechanical shock are an issue.

It withstands cryogenic temperatures and meets NASA low outgassing specifications. This versatile system is used for a wide variety of structural, electronic, aerospace, medical, and oil & chemical processing applications. EP21TDCHT-LO has a convenient mix ratio of 1:1 by weight or volume and is formulated to cure at room temperature or more rapidly at elevated temperatures.

As a toughened system, EP21TDCHT-LO is particularly well suited for bonding dissimilar substrates, especially when they have differing coefficients of expansion. It has an outstanding service temperature range from 4K to +350ºF. Other notable features include a shear strength exceeding 2,500 psi, a peel strength of greater than 20 pli, and a Shore D hardness of greater than 60. The cured epoxy has excellent chemical resistance and is an electrical insulator.

Parts A and B are available in half pint, pint, quart, one gallon and five gallon containers.

Master Bond Low Outgassing Epoxies

Master Bond EP21TDCHT-LO is toughened, cryogenically serviceable two part epoxy that meets NASA low outgassing specifications. Read more about Master Bond's fast curing epoxies at http://www.masterbond.com/lp/tabs/tp_pp_lowoutgas.html or contact Technical Support by phone at +1-201-343-8983, by fax at +1-201-343-2132 or by e-mail at technical@masterbond.com.

CONTACT:

James Brenner, Marketing Manager

Email: jbrenner@masterbond.com

Tel: 201-343-8983

Fax: 201-343-2132

MASTER BOND INC.

154 Hobart Street

Hackensack, NJ 07601-3922

Web: www.masterbond.com

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