At the 24 th European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) 2009 in Hamburg, the Bystronic glass group will present a machine for the efficient encapsulating and sealing of photovoltaic modules. At the approximately 140 sqm stand 108 in hall B6 visitors will be able to view the first machine for the application of high-viscous butyl on semiconductor thin-film substrates being at work: the photovoltaic-TPA (Thermo Plastic Applicator). 

Proven machine technology with new application Over ten years ago, Bystronic Lenhardt GmbH developed a process, during which the metallic spacer frame normally used in the insulating glass production between the two lites was replaced by a thermo plastic spacer. Due to its great flexibility and its excellent sealing properties, this TPS® material is ideally suited for use in the photovoltaic industry:

a) For encapsulating filmless thin-layer modules The photovoltaic-TPA can generate spaces between 1 and 6 millimetres. Opposed to lamination, this encapsulating method uses considerably less energy as it operates without any heating or cooling. Depending on the module size, the cycle times are approximately 30 to 45 seconds. 

b) For sealing of semi-conductor systems Butyl is suitable for sealing of modules based on copper-indium-diselenide (Cis) or copper-indium-gallium-diselenide (Cigs) and cadmium telluride (CaTe). The machine is available in both horizontal and vertical options. Depending on the film thickness, the application thickness of the butyl varies between 0.5 to 1 millimetres – with the most precise application. Integration into complete back-end lines and existing plants is possible. Thanks to a dual drum pump system, the machine is able to operate 24 hours a day, 7 days a week.