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New Electrically Conductive, Silver Filled Adhesive/Sealant is USP Class VI Approved

Developed for rigorous bonding and sealing in demanding manufacturing applications, Master Bond EP3HTSMED epoxy system features a rapid cure schedule and a tensile shear strength exceeding 1,000 psi. It is 100% reactive and fully meets USP Class VI requirements for medical applications.

This silver-filled epoxy adhesive/sealant has remarkable electrical conductivity with a volume resistivity less than 0.001 ohm cm. Serviceable over the wide temperature range of -60°F to 400°F, EP3HTSMED is resistant to severe thermal cycling and many chemicals including water, fuels, oil, and most organic solvents.

EP3HTSMED is a thixotropic paste and has a specific gravity of 2.90 at 77°F. It requires no mixing and needs only contact pressure during a simple heat cure of 20 to 40 minutes at 300°F or 40 to 90 minutes at 250°F. With minimal shrinkage during cure and a Shore D hardness of 60 to 80, EP3HTSMED bonds well to a variety of substrates including metals, glass, vulcanized rubbers, ceramics, and many plastics.

Silver in color, this one component adhesive is packaged in syringes or glass jars. EP3HTSMED has a shelf life of 6 months in a glass jar and a shelf life 3 months when stored in a syringe at room temperature.

Master Bond High Strength, Electrically Conductive Adhesives

Master Bond EP3HTSMED offers exceptional thermal and electrical conductivity while fully meeting USP Class VI requirements. This no mix epoxy adhesive has versatile, rapid cure schedules. Read more about Master Bond's electrically conductive adhesives at http://www.masterbond.com/properties/electrically-conductive-adhesive-systems or contact Master Bond's Technical Support Team by phone at +1-201-343-8983, by fax at +1-201-343-2132 or by e-mail at techinfo@masterbond.com.

CONTACT:
James Brenner, Marketing Manager
Email: jbrenner@masterbond.com
Tel: 201-343-8983
Fax: 201-343-2132

MASTER BOND INC.
154 Hobart Street
Hackensack, NJ 07601-3922
Web: www.masterbond.com

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January 19th, 2012
Photo: Master Bond
Source: Master Bond


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